• LCD Scribing                   
• Film Attachment
  
• Grinding             ​

• COG Bonding                   
• FOG Bonding
• ​​FOB Bonding

• OCA Lamination (2”~27”)
• Polish (2"~10")

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- LCD Scribing

• Capability: Max. Scribing Dimension 92cmx73cm ( 28.7”x36.2”), Tolerance +/- 0.1mm
• Capacity: 180K (Base on 7”, 30 Days)

• Scribe glass cutting service capable for 92cmx73cm as largest  
• Liquid Crystal Displays (LCD) substrate.
• The scribe-break is an contamination free cutting method with waterless, heatless and dust-free.
• Scribing is the key of glass cutting process, lateral cracks are prohibited while scribing the median crack for a clear cutting on substrate.

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- LCD Grinding

• Capability: Max. Grinding Dimension 92cmx73cm ( 28.7”x36.2”), Tolerance +/- 0.15mm
• Capacity: 18K (Base on 7”, 30 Days)​

• MITSUBISHI M70 high-level control system:

          (1) Three-axis, low-inertia, high-torque motor to do three-axis  
                control, three-axis simultaneous engraving and milling.
          (2) Ultimate PLC human machine interface detect and display
​                each warning message.

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- Glass Polish

• Capability: Max. Polish Dimension 28cmx28cm ( 11”x11”), Tolerance +/- 1.0 µm
• Capacity: depends on customer’s design

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- Process: Soft to Hard

• Capability: 1.5”~G4.5, tolerance +/-0.1mm
• Polarizer、Explosion-Proof Membrane、Functional Film、OCA on Glass
• Capacity: 240K (Base on 7”, 30 Days)

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- Process: COG

• Capability: Chip on Glass  (Up to 12.1”), Tolerance +/-6um.
• Capacity : 150K ( Based on 7”, 30 Days)​​

- Process: FOG

• Capability: FPC on Glass (Up to 15.6”), tolerance +/-0.02mm
• Capacity: 225K (Based on 7”, 30 Days)​​

- Process: ACF Attachment

• Capability: ACF on Glass (Up to 7”), tolerance +/-0.02mm
• Capacity: 45K (Based on 7”, 30 Days)

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- Process: Hard to Hard

• Capability: Module OCA Lamination (Up to 27”), tolerance +/-0.1mm
• Capacity: 100K (Based on 7”, 30 Days)

• Module & T/P Cover Glass Service

           A Machine: Available Size from 2” to 7”
           B Machine: Available Size from 5” to 12”
           C Machine: Available Size from 12” to 27”

Module on hardening coverglass for Ball Drop Test (27" to 86), tolerance +/-0.3mm

• Capacity: 10K (Based on Size)

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- LCD Capacity (Yang-Mei Facility)

- LCD Capability (Yang-Mei Facility)

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- Backlight Module ODM Services

• Fiber Laser Cutting
• Electric Bending 

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- Fiber Laser Cutting

• Capability: Max. Cutting Dimension 100cmx200cm, Tolerance +/- 0.5mm

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- Electric Bending

• Capability: Max. Bending Dimension 200cmx200cm, Tolerance +/- 0.2mm

All-electric Servo Folding Bed

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- Technical Capability (Yang-Mei Facility)

Screen Size	Diagonal Length	Bottom Length (cm)	High (cm)	Visible Area (cm^2)	Magnification
32	81.28	70.85	39.83	2821.99	0.5804989
40	101.6	88.57	49.79	4409.36	0.9070295
42	106.68	92.99	52.28	4861.32	1
46	116.84	101.85	57.25	5831.38	1.1995465
52	132.08	115.14	64.72	7451.82	1.5328798
55	139.7	121.78	68.46	8336.45	1.7148526
58	147.32	128.42	72.19	9270.69	1.9070295
60	152.4	132.85	74.68	9921.07	2.0408163
65	165.1	143.92	80.90	11643.47	2.3951247
70	177.8	154.99	87.13	13503.68	2.7777778
80	203.2	177.13	99.57	17637.45	3.6281179

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- FAB Layout ​(LY - Yang-Mei Facility)

2F
Fab area：300 square meters  class 10000    
COG bonding  area class 100 
​
Major process：Cutting、COG bonding、FOG bonding、FOB bonding、ACF Attachment 、TCP punch、COF punch

- FAB Layout ​(LY - Yang-Mei Facility)

1F
Fab area：185 square meters class 1000     
Clean BOX  & Attachment  Area  class 100     

Major process：
Film Attachment、OCA  Attachment、Assembly、UV Coating、 Silicone Coating、 Soldering、OCA repair