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- LCD Scribing
- Capability: Max. Scribing Dimension 92cmx73cm ( 28.7”x36.2”), Tolerance +/- 0.1mm
- Capacity: 180K (Base on 7”, 30 Days)
- Scribe glass cutting service capable for 92cmx73cm as largest
- Liquid Crystal Displays (LCD) substrate.
- The scribe-break is an contamination free cutting method with waterless, heatless and dust-free.
- Scribing is the key of glass cutting process, lateral cracks are prohibited while scribing the median crack for a clear cutting on substrate.
- LCD Grinding
- Capability: Max. Grinding Dimension 92cmx73cm ( 28.7”x36.2”), Tolerance +/- 0.15mm
- Capacity: 18K (Base on 7”, 30 Days)
- Glass Polish
- Capability: Max. Polish Dimension 28cmx28cm ( 11”x11”), Tolerance +/- 1.0 µm
- Capacity: depends on customer’s design
- Process: Soft to Hard
- Capability: 1.5”~G4.5, tolerance +/-0.1mm
- Polarizer、Explosion-Proof Membrane、Functional Film、OCA on Glass
- Capacity: 240K (Base on 7”, 30 Days)
- Process: COG
- Capability: Chip on Glass (Up to 12.1”), Tolerance +/-6um.
- Capacity : 150K ( Based on 7”, 30 Days)
- Process: FOG
- Capability: FPC on Glass (Up to 15.6”), tolerance +/-0.02mm
- Capacity: 225K (Based on 7”, 30 Days)
- Process: ACF Attachment
- Capability: ACF on Glass (Up to 7”), tolerance +/-0.02mm
- Capacity: 45K (Based on 7”, 30 Days)
- Process: Hard to Hard
- Capability: Module OCA Lamination (Up to 27”), tolerance +/-0.1mm
- Capacity: 100K (Based on 7”, 30 Days)
Module on hardening coverglass for Ball Drop Test (27" to 86), tolerance +/-0.3mm
- Capacity: 10K (Based on Size)
- LCD Capacity (Yang-Mei Facility)
- LCD Capability (Yang-Mei Facility)
- Backlight Module ODM Services
- Fiber Laser Cutting
- Electric Bending
- Fiber Laser Cutting
- Capability: Max. Cutting Dimension 100cmx200cm, Tolerance +/- 0.5mm
- Electric Bending
- Capability: Max. Bending Dimension 200cmx200cm, Tolerance +/- 0.2mm
- Technical Capability (Yang-Mei Facility)
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- FAB Layout (LY - Yang-Mei Facility)2F
Fab area:300 square meters class 10000 COG bonding area class 100 Major process:Cutting、COG bonding、FOG bonding、FOB bonding、ACF Attachment 、TCP punch、COF punch |
- FAB Layout (LY - Yang-Mei Facility)1F
Fab area:185 square meters class 1000 Clean BOX & Attachment Area class 100 Major process: Film Attachment、OCA Attachment、Assembly、UV Coating、 Silicone Coating、 Soldering、OCA repair |