• LCD Scribing                   
• Film Attachment
• OCA Lamination (2”~27”)

• COG Bonding 
  
• COG + FOG 2-in-1                 
• FOG Bonding / FOB Bonding
• ​​ACF Attachment

• Fiber Laser Cutting
• Electric Bending
• Punch Form

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- LCD Scribing

• Capability: Max. Scribing Dimension 92cmx73cm ( 28.7”x36.2”), Tolerance +/- 0.1mm
• Capacity: 180K (Base on 7”, 30 Days)

• Scribe glass cutting service capable for 92cmx73cm as largest  
• Liquid Crystal Displays (LCD) substrate.
• The scribe-break is a contamination free cutting method with waterless, heatless and dust-free.
• Scribing is the key of glass cutting process, lateral cracks are prohibited while scribing the median crack for a clear cutting on substrate.

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- Process: Soft to Hard

• Capability: 1.5”~43", tolerance +/-0.1mm
• Polarizer, Explosion-Proof Membrane, Functional Film, OCA on Glass
• Capacity: 240K (Base on 7”, 30 Days)

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- Process: COG

• Capability: Chip on Glass  (Up to 12.1”), Tolerance +/-6um.
• Capacity : 150K ( Based on 7”, 30 Days)​​

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- Panasonic COG and FOG 2-in-1 Machines

This two-in-one machine is ideal for monitors used in vehicles, military, or marine, as it meets quality requirements and saves on processing costs. Overall, the Panasonic COG & FOG two-in-one machine is a great solution for LCD OEM.

• Its working area is 12.1" and is combined with Robot and loading/unloading automation.
• The CCD makes the machine fully automatic, reducing errors caused by manual alignment.

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Process: ACF Attachment

• Capability: ACF on Glass (Up to 7”), tolerance +/-0.02mm
• Capacity: 45K (Based on 7”, 30 Days)

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- Process: FOG

• Capability: FPC on Glass (Up to 15.6”), tolerance +/-0.02mm
• Capacity: 225K (Based on 7”, 30 Days)​​

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- Process: Hard to Hard

• Capability: Module OCA Lamination (Up to 27”), tolerance +/-0.1mm
• Capacity: 100K (Based on 7”, 30 Days)

• Module & T/P Cover Glass Service

           A Machine: Available Size from 2” to 7”
           B Machine: Available Size from 5” to 12”
           C Machine: Available Size from 12” to 27”

Module on hardening coverglass for Ball Drop Test (27" to 86), tolerance +/-0.3mm

• Capacity: 10K (Based on Size)

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- LCD Capacity (Yang-Mei Facility)

- LCD Capability (Yang-Mei Facility)

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- Backlight Module ODM Services

• Fiber Laser Cutting
• Electric Bending 
• Punch Form

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- Fiber Laser Cutting

• Capability: Max. Cutting Dimension 100*200cm, tolerance +/- 0.5mm

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- Electric Bending

• Capability: Max. Bending Dimension 200cmx200cm, Tolerance +/- 0.2mm

All-electric Servo Folding Bed

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- Technical Capability (Yang-Mei Facility)

Screen Size	Diagonal Length	Bottom Length (cm)	High (cm)	Visible Area (cm^2)	Magnification
32	81.28	70.85	39.83	2821.99	0.5804989
40	101.6	88.57	49.79	4409.36	0.9070295
42	106.68	92.99	52.28	4861.32	1
46	116.84	101.85	57.25	5831.38	1.1995465
52	132.08	115.14	64.72	7451.82	1.5328798
55	139.7	121.78	68.46	8336.45	1.7148526
58	147.32	128.42	72.19	9270.69	1.9070295
60	152.4	132.85	74.68	9921.07	2.0408163
65	165.1	143.92	80.90	11643.47	2.3951247
70	177.8	154.99	87.13	13503.68	2.7777778
80	203.2	177.13	99.57	17637.45	3.6281179

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Punch Form

• Capability: Max. Punch Dimension 750mmx450mm, Tolerance +/- 0.3mm

5"~32"

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- FAB Layout ​(LY - Yang-Mei Facility)

1F
Fab area：185 square meters class 1000     
Clean BOX & Attachment Area class 100     

Major process：
Film Attachment, OCA  Attachment, Assembly, UV Coating,  Silicone Coating,  Soldering, OCA repair

- FAB Layout ​(LY - Yang-Mei Facility)

2F
Fab area：300 square meters  class 10000    
COG bonding  area class 100 
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Major process：Cutting、COG bonding、FOG bonding、FOB bonding、ACF Attachment 、TCP punch、COF punch